The semiconductor assembly and testing services are defined as cloud services which require less management and easier application development platform. It enables companies to conduct programming and all other tasks without having to manage any server. The increase in adoption of cloud services is expected to drive the global semiconductor assembly and testing services market growth.
Market Drivers
The increase in demand for electronic equipment by the customers is a key driving factor which is expected to boost the global semiconductor assembly and testing services market growth. The manufacturers are investing in producing new electronic products will positively influence the market growth. The increase in popularity of advanced system in package (SIP) modules is considered as one of the key trends which will gain traction in the global semiconductor assembly and testing services market growth during this forecast period. The SIP modules are used in mobile devices such as solid state drives, wireless devices, media players, and automotive applications to combine functions performed by different ICs into a single module. These modules enable manufacturers to integrate communication units like Bluetooth, modems, and WI-FI into one package. Moreover, the increase in adoption of the SIP modules will support the market growth.
A high cost associated with larger fabrication is a major restraint which expected to hamper the global semiconductor assembly and testing services market growth during this forecast period.
The Global Semiconductor Assembly and Testing Services Market is segmented into product type such as Assembly and Packaging Services, and Testing Services. Further, market is segmented into application such as Computing & Networking, Consumer Electronics, Communication, Industrial, and Automotive Electronics.
Also, the Global Semiconductor Assembly and Testing Services Market is segmented into five regions such as North America, Latin America, Europe, Asia Pacific, and Middle East & Africa.
Various key players are discussed in this report such as Amkor Technology, ASE Technology Holding Co., Ltd., Powertech Technology Inc., Integrated Micro-Electronics, Inc., Chipbond Technology Corporation, GlobalFoundries, UTAC Group, TongFu Microelectronics Co., Ltd., King Yuan ELECTRONICS CO., LTD, etc.
1 Introduction
1.1 Objective of the Study
1.2 Market definition
1.3 Market Scope
2 Research Methodology
2.1 Data Mining
2.2 Validation
2.3 Primary Interviews
2.4 List of Data Sources
3 Executive Summary
4 Global Semiconductor Assembly and Testing Services Market Outlook
4.1 Overview
4.2 Market Dynamics
4.2.1 Drivers
4.2.2 Restraints
4.2.3 Opportunities
4.3 Porters Five Force Model
4.4 Value Chain Analysis
5 Global Semiconductor Assembly and Testing Services Market, By Product Type
5.1 Y-o-Y Growth Comparison, By Product Type
5.2 Global Semiconductor Assembly and Testing Services Market Share Analysis, By Product Type
5.3 Global Semiconductor Assembly and Testing Services Market Size and Forecast, By Product Type
5.3.1 Assembly and Packaging Services
5.3.2 Testing Services
6 Global Semiconductor Assembly and Testing Services Market, By Application
6.1 Y-o-Y Growth Comparison, By Application
6.2 Global Semiconductor Assembly and Testing Services Market Share Analysis, By Application
6.3 Global Semiconductor Assembly and Testing Services Market Size and Forecast, By Application
6.3.1 Computing & Networking
6.3.2 Consumer Electronics
6.3.3 Communication
6.3.4 Industrial
6.3.5 Automotive Electronics
7Global Semiconductor Assembly and Testing Services Market, By Region
7.1 Global Semiconductor Assembly and Testing Services Market Share Analysis, By Region
7.2 Global Semiconductor Assembly and Testing Services Market Share Analysis, By Region
7.3 Global Semiconductor Assembly and Testing Services Market Size and Forecast, By Region
8North America Semiconductor Assembly and Testing Services Market Analysis and Forecast (2020 – 2030)
8.1 Introduction
8.2 North America Semiconductor Assembly and Testing Services Market Share Analysis, By Product Type
8.3 North America Semiconductor Assembly and Testing Services Market Size and Forecast, By Application
8.4 North America Semiconductor Assembly and Testing Services Market Size and Forecast, By Country
8.4.1 U.S
8.4.2 Canada
8.4.3 Mexico
9Europe Semiconductor Assembly and Testing Services Market Analysis and Forecast (2020 – 2030)
9.1 Introduction
9.2 Europe Semiconductor Assembly and Testing Services Market Share Analysis, By Product Type
9.3 Europe Semiconductor Assembly and Testing Services Market Size and Forecast, By Application
9.4 Europe Semiconductor Assembly and Testing Services Market Size and Forecast, By Country
9.4.1 Germany
9.4.2 France
9.4.3 UK
9.4.4. Rest of Europe
10Asia Pacific Semiconductor Assembly and Testing Services Market Analysis and Forecast (2020 – 2030)
10.1 Introduction
10.2 Asia Pacific Semiconductor Assembly and Testing Services Market Share Analysis, By Product Type
10.3 Asia Pacific Semiconductor Assembly and Testing Services Market Size and Forecast, By Application
10.4 Asia Pacific Semiconductor Assembly and Testing Services Market Size and Forecast, By Country
10.4.1 China
10.4.2 Japan
10.4.3 India
10.4.4. Rest of Asia Pacific
11Latin America Semiconductor Assembly and Testing Services Market Analysis and Forecast (2020 – 2030)
11.1 Introduction
11.2 Latin America Semiconductor Assembly and Testing Services Market Share Analysis, By Product Type
11.3 Latin America Semiconductor Assembly and Testing Services Market Size and Forecast, By Application
11.4 Latin America Semiconductor Assembly and Testing Services Market Size and Forecast, By Country
12Middle East Semiconductor Assembly and Testing Services Market Analysis and Forecast (2020 – 2030)
12.1 Introduction
12.2 Middle East Semiconductor Assembly and Testing Services Market Share Analysis, By Product Type
12.3 Middle East Semiconductor Assembly and Testing Services Market Size and Forecast, By Application
12.4 Middle East Semiconductor Assembly and Testing Services Market Size and Forecast, By Country
13Competitive Analysis
13.1 Competition Dashboard
13.2 Market share Analysis of Top Vendors
13.3 Key Development Strategies
14Company Profiles
14.1 Amkor Technology
14.1.1 Overview
14.1.2 Offerings
14.1.3 Key Financials
14.1.4 Business Segment & Geographic Overview
14.1.5 Key Market Developments
14.1.6 Key Strategies
14.2 ASE Technology Holding Co., Ltd
14.2.1 Overview
14.2.2 Offerings
14.2.3 Key Financials
14.2.4 Business Segment & Geographic Overview
14.2.5 Key Market Developments
14.2.6 Key Strategies
14.3 Powertech Technology Inc
14.3.1 Overview
14.3.2 Offerings
14.3.3 Key Financials
14.3.4 Business Segment & Geographic Overview
14.3.5 Key Market Developments
14.3.6 Key Strategies
14.4 Integrated Micro-Electronics, Inc
14.4.1 Overview
14.4.2 Offerings
14.4.3 Key Financials
14.4.4 Business Segment & Geographic Overview
14.4.5 Key Market Developments
14.4.6 Key Strategies
14.5 Chipbond Technology Corporation
14.5.1 Overview
14.5.2 Offerings
14.5.3 Key Financials
14.5.4 Business Segment & Geographic Overview
14.5.5 Key Market Developments
14.5.6 Key Strategies
14.6 GlobalFoundries
14.6.1 Overview
14.6.2 Offerings
14.6.3 Key Financials
14.6.4 Business Segment & Geographic Overview
14.6.5 Key Market Developments
14.6.6 Key Strategies
14.7 UTAC Group
14.7.1 Overview
14.7.2 Offerings
14.7.3 Key Financials
14.7.4 Business Segment & Geographic Overview
14.7.5 Key Market Developments
14.7.6 Key Strategies
14.8 TongFu Microelectronics Co., Ltd
14.8.1 Overview
14.8.2 Offerings
14.8.3 Key Financials
14.8.4 Business Segment & Geographic Overview
14.8.5 Key Market Developments
14.8.6 Key Strategies
14.9 King Yuan ELECTRONICS CO
14.9.1 Overview
14.9.2 Offerings
14.9.3 Key Financials
14.9.4 Business Segment & Geographic Overview
14.9.5 Key Market Developments
14.9.6 Key Strategies
