Global Radiation-Hardened Electronics Market 

Radiation hardening is defined as the act of manufacturing electronic components and can withstand the damage caused by ionizing radiation such as particle radiation, and high energy electromagnetic radiation. These products are classically tested one or more resultant effect tests, including total ionizing dose, enhanced low dose rate effects, and single event effects.

Market Drivers

Increase in global intelligence, surveillance & reconnaissance operations is the key driving factor which is expected to boost the global radiation-hardened electronics market growth. Furthermore, increase in advancements in FPGA & multicore processor technologies for defense and space applications will have the positive impact on market growth. Moreover, increase in research and development activities across the globe will propel the market growth. In addition to that, growing requirements for reconfigurable Rad-Hard Components will drive the market growth.

  Market Restraints

However, high costs of development and design is the major restraining factor which is expected to hinder the global radiation-hardened electronics market growth. Also, difficulties in creating actual testing environment will affect the market growth.

Market Segmentation

Global Radiation-Hardened Electronics Market is segmented into component such as Microprocessor, Memory, FPGA, and Sensors. Further, market is segmented into application such as Aerospace & Defense, and Nuclear Power Plants.

Also, Global Radiation-Hardened Electronics Market is segmented into five regions such as North America, Latin America, Europe, Asia Pacific, and Middle East & Africa.

Market Key Players

Various key players are discussed in this report such as  BAE Systems PLC, Honeywell Aerospace,  Microsemi Corp., Microchip Technology Inc., Xilinx, Inc., Texas Instruments, Inc., St Microelectronics NV, and Maxwell Technologies, Inc.

Market Taxonomy

By Component

  • Microprocessor
  • Memory
  • FPGA
  • Sensors

By Application

  • Aerospace & Defense
  • Nuclear Power Plants

By Region

  • North America
  • Latin America
  • Europe
  • Asia Pacific
  • Middle East & Africa

Key Questions Addressed by the Report

  • What are the Key Opportunities in Global Radiation- Hardened Electronics Market?
  • What will be the growth rate from 2019 to 2030?
  • Which segment/region will have highest growth?
  • What are the factors that will impact/drive the Market?
  • What is the competitive Landscape in the Industry?
  • What is the role of key players in the value chain?
  • What are the strategies adopted by key players?

Global Radiation-Hardened Electronics Market 

1 Introduction
1.1 Objective of the Study
1.2 Market definition
1.3 Market Scope

2 Research Methodology

2.1 Data Mining
2.2 Validation
2.3 Primary Interviews
2.4 List of Data Sources

3 Executive Summary
4 Global Radiation-Hardened Electronics Market Outlook
4.1 Overview
4.2 Market Dynamics
4.2.1 Drivers
4.2.2 Restraints
4.2.3 Opportunities
4.3 Porters Five Force Model
4.4 Value Chain Analysis

5 Global Radiation-Hardened Electronics Market, By Component
5.1 Y-o-Y Growth Comparison, By Component

5.2 Global Radiation-Hardened Electronics Market Share Analysis, By Component

5.3 Global Radiation-Hardened Electronics Market Size and Forecast, By Component
5.3.1 Microprocessor

5.3.2 Memory

5.3.3FPGA

5.3.4Sensors

6 Global Radiation-Hardened Electronics Market, By Application
6.1 Y-o-Y Growth Comparison, By Application

6.2 Global Radiation-Hardened Electronics Market Share Analysis, By Application

6.3 Global Radiation-Hardened Electronics Market Size and Forecast, By Application
6.3.1 Aerospace & Defense
6.3.2 Nuclear Power Plants

7Global Radiation-Hardened Electronics Market, By Region
7.1 Global Radiation-Hardened Electronics Market Share Analysis, By Region

7.2 Global Radiation-Hardened Electronics Market Share Analysis, By Region

7.3 Global Radiation-Hardened Electronics Market Size and Forecast, By Region

8North America Radiation-Hardened Electronics Market Analysis and Forecast (2017 – 2030)
8.1 Introduction

8.2 North America Radiation-Hardened Electronics Market Share Analysis, By Component

8.3 North America Radiation-Hardened Electronics Market Size and Forecast, By Application

8.4 North America Radiation-Hardened Electronics Market Size and Forecast, By Country

8.4.1 U.S
8.4.2 Canada
8.4.3 Mexico

9Europe Radiation-Hardened Electronics Market Analysis and Forecast (2017 – 2030)
9.1 Introduction

9.2 Europe Radiation-Hardened Electronics Market Share Analysis, By Component

9.3 Europe Radiation-Hardened Electronics Market Size and Forecast, By Application

9.4 Europe Radiation-Hardened Electronics Market Size and Forecast, By Country

9.4.1 Germany
9.4.2 France
9.4.3 UK

9.4.4. Rest of Europe

10Asia Pacific Radiation-Hardened Electronics Market Analysis and Forecast (2017 – 2030)
10.1 Introduction

10.2 Asia Pacific Radiation-Hardened Electronics Market Share Analysis, By Component

10.3 Asia Pacific Radiation-Hardened Electronics Market Size and Forecast, By Application

10.4 Asia Pacific Radiation-Hardened Electronics Market Size and Forecast, By Country

10.4.1 China
10.4.2 Japan
10.4.3 India

10.4.4. Rest of Asia Pacific

11Latin America Radiation-Hardened Electronics Market Analysis and Forecast (2017 – 2030)
11.1 Introduction

11.2 Latin America Radiation-Hardened Electronics Market Share Analysis, By Component

11.3 Latin America Radiation-Hardened Electronics Market Size and Forecast, By Application

11.4 Latin America Radiation-Hardened Electronics Market Size and Forecast, By Country

12Middle East Radiation-Hardened Electronics Market Analysis and Forecast (2017 – 2030)
12.1 Introduction

12.2 Middle East Radiation-Hardened Electronics Market Share Analysis, By Component

12.3 Middle East Radiation-Hardened Electronics Market Size and Forecast, By Application

12.4 Middle East Radiation-Hardened Electronics Market Size and Forecast, By Country

13Competitive Analysis
13.1 Competition Dashboard
13.2 Market share Analysis of Top Vendors
13.3 Key Development Strategies

14Company Profiles

15.1 BAE Systems PLC,
15.1.1 Overview
15.1.2 Offerings
15.1.3 Key Financials
15.1.4 Business Segment & Geographic Overview

15.1.5 Key Market Developments

15.1.6 Key Strategies

15.2 Honeywell Aerospace

15.2.1 Overview
15.2.2 Offerings
15.2.3 Key Financials
15.2.4 Business Segment & Geographic Overview

15.2.5 Key Market Developments

15.2.6 Key Strategies

15.3 Microsemi Corp
15.3.1 Overview
15.3.2 Offerings
15.3.3 Key Financials
15.3.4 Business Segment & Geographic Overview

15.3.5 Key Market Developments

15.3.6 Key Strategies

15.4 Microchip Technology Inc
15.4.1 Overview
15.4.2 Offerings
15.4.3 Key Financials
15.4.4 Business Segment & Geographic Overview

15.4.5 Key Market Developments

15.4.6 Key Strategies

15.5 Xilinx, Inc
15.5.1 Overview
15.5.2 Offerings
15.5.3 Key Financials
15.5.4 Business Segment & Geographic Overview

15.5.5 Key Market Developments

15.5.6 Key Strategies

15.6 Texas Instruments, Inc
15.6.1 Overview
15.6.2 Offerings
15.6.3 Key Financials
15.6.4 Business Segment & Geographic Overview

15.6.5 Key Market Developments

15.6.6 Key Strategies

15.7 St Microelectronics NV
15.7.1 Overview
15.7.2 Offerings
15.7.3 Key Financials
15.7.4 Business Segment & Geographic Overview

15.7.5 Key Market Developments

15.7.6 Key Strategies

15.8 Maxwell Technologies, Inc

15.8.1 Overview
15.8.2 Offerings
15.8.3 Key Financials
15.8.4 Business Segment & Geographic Overview

15.8.5 Key Market Developments

15.8.6 Key Strategies