Multi-chip module is an integral part of modern electronic systems which contains up to five chips. These chips are connected via wirebonds to a multilayer circuit board & a molded encapsulant is used for its protection. Multi-chip module provide high-integration density, better performance, and low power consumption.
The increase in demand for semiconductor products having low electromagnetic interference and high capacitance is expected to boost the global multi-chip module market growth. Furthermore, the growth of IoT create requirements for memory, which further positively influence the multi-chip module market growth during this forecast timeline. Also, the growth of connected cars is expected to witness massive demand for a multi-chip module during this forecast period. Moreover, advent of power efficient and smarter connecting devices such as smart TV and different home automation products is also anticipated to fuel the market growth. In addition, the growing need of consumer electronics manufacturers to minimize manufacturing cost of the product is also propel the demand of multi-chip module in near future.
High initial cost is the major challenging factor which expected to hinder the global multi-chip module market growth over the forecast period. Also, cyclical nature of semiconductor industry may hamper the market growth.
The Global Multi-chip Module Market is segmented into type such as NAND-Based MCP, NOR-Based MCP, eMCP, and uMCP. Further, market is segmented into end user such as Automotive, Consumer Electronics, Healthcare, Aerospace & Defense, and Others.
Also, the Global Multi-chip Module Market is segmented into five regions such as North America, Latin America, Europe, Asia Pacific, and Middle East & Africa.
Various key players are discussed in this report such as Texas Instruments, Infineon Technologies, STMicroelectronics, Intel, SK Hynix Inc.,Samsung Electronics, Micron Technology, Macronix International Co., Ltd., Cypress Semiconductor Corporation, and Tektronix, Inc.etc.
By Type
NAND-Based MCP NOR-Based MCP eMCP uMCP
By End User
Automotive Consumer Electronics Healthcare Aerospace & Defense Others
By Region
North America Latin America Europe Asia Pacific Middle East & Africa
Key Questions Addressed by the Report
What are the Key Opportunities in Global Multi-chip Module Market? What will be the growth rate from 2019 to 2030? Which segment/region will have highest growth? What are the factors that will impact/drive the Market? What is the competitive Landscape in the Industry? What is the role of key players in the value chain? What are the strategies adopted by key players?
Global Multi-chip Module Market TOC
1 Introduction 1.1 Objective of the Study 1.2 Market definition 1.3 Market Scope
2 Research Methodology
2.1 Data Mining 2.2 Validation 2.3 Primary Interviews 2.4 List of Data Sources
3 Executive Summary 4 Global Multi-chip Module Market Outlook 4.1 Overview 4.2 Market Dynamics 4.2.1 Drivers 4.2.2 Restraints 4.2.3 Opportunities 4.3 Porters Five Force Model 4.4 Value Chain Analysis
5 Global Multi-chip Module Market, By Type 5.1 Y-o-Y Growth Comparison, By Type
5.2 Global Multi-chip Module Market Share Analysis, By Type
5.3 Global Multi-chip Module Market Size and Forecast, By Type 5.3.1 NAND-Based MCP
5.3.2NOR-Based MCP
5.3.3 eMCP
5.3.4 uMCP
6 Global Multi-chip Module Market, By End User 6.1 Y-o-Y Growth Comparison, By End User
6.2 Global Multi-chip Module Market Share Analysis, By End User
6.3 Global Multi-chip Module Market Size and Forecast, By End User 6.3.1 Automotive
6.3.2 Consumer Electronics
6.3.3 Healthcare
6.3.4 Aerospace & Defense
Others 7Global Multi-chip Module Market, By Region 7.1 Global Multi-chip Module Market Share Analysis, By Region
7.2 Global Multi-chip Module Market Share Analysis, By Region
7.3 Global Multi-chip Module Market Size and Forecast, By Region
8North America Multi-chip Module Market Analysis and Forecast (2020 – 2030) 8.1 Introduction
8.2 North America Multi-chip Module Market Share Analysis, By Type
8.3 North America Multi-chip Module Market Size and Forecast, By End User
8.4 North America Multi-chip Module Market Size and Forecast, By Country
8.4.1 U.S 8.4.2 Canada 8.4.3 Mexico
9Europe Multi-chip Module Market Analysis and Forecast (2020 – 2030) 9.1 Introduction
9.2 Europe Multi-chip Module Market Share Analysis, By Type
9.3 Europe Multi-chip Module Market Size and Forecast, By End User
9.4 Europe Multi-chip Module Market Size and Forecast, By Country
9.4.1 Germany 9.4.2 France 9.4.3 UK
9.4.4. Rest of Europe
10Asia Pacific Multi-chip Module Market Analysis and Forecast (2020 – 2030) 10.1 Introduction
10.2 Asia Pacific Multi-chip Module Market Share Analysis, By Type
10.3 Asia Pacific Multi-chip Module Market Size and Forecast, By End User
10.4 Asia Pacific Multi-chip Module Market Size and Forecast, By Country
10.4.1 China 10.4.2 Japan 10.4.3 India
10.4.4. Rest of Asia Pacific
11Latin America Multi-chip Module Market Analysis and Forecast (2020 – 2030) 11.1 Introduction
11.2 Latin America Multi-chip Module Market Share Analysis, By Type
11.3 Latin America Multi-chip Module Market Size and Forecast, By End User
11.4 Latin America Multi-chip Module Market Size and Forecast, By Country
12Middle East Multi-chip Module Market Analysis and Forecast (2020 – 2030) 12.1 Introduction
12.2 Middle East Multi-chip Module Market Share Analysis, By Type
12.3 Middle East Multi-chip Module Market Size and Forecast, By End User
12.4 Middle East Multi-chip Module Market Size and Forecast, By Country
13Competitive Analysis 13.1 Competition Dashboard 13.2 Market share Analysis of Top Vendors 13.3 Key Development Strategies
14Company Profiles
14.1 Texas Instruments 14.1.1 Overview 14.1.2 Offerings 14.1.3 Key Financials 14.1.4 Business Segment & Geographic Overview
14.1.5 Key Market Developments
14.1.6 Key Strategies
14.2 Infineon Technologies
14.2.1 Overview 14.2.2 Offerings 14.2.3 Key Financials 14.2.4 Business Segment & Geographic Overview
14.2.5 Key Market Developments
14.2.6 Key Strategies
14.3 STMicroelectronics 14.3.1 Overview 14.3.2 Offerings 14.3.3 Key Financials 14.3.4 Business Segment & Geographic Overview
14.3.5 Key Market Developments
14.3.6 Key Strategies
14.4 Intel 14.4.1 Overview 14.4.2 Offerings 14.4.3 Key Financials 14.4.4 Business Segment & Geographic Overview
14.4.5 Key Market Developments
14.4.6 Key Strategies
14.5 SK Hynix Inc 14.5.1 Overview 14.5.2 Offerings 14.5.3 Key Financials 14.5.4 Business Segment & Geographic Overview
14.5.5 Key Market Developments
14.5.6 Key Strategies
14.6 Samsung Electronics 14.6.1 Overview 14.6.2 Offerings 14.6.3 Key Financials 14.6.4 Business Segment & Geographic Overview
14.6.5 Key Market Developments
14.6.6 Key Strategies
14.7 Micron Technology 14.7.1 Overview 14.7.2 Offerings 14.7.3 Key Financials 14.7.4 Business Segment & Geographic Overview
14.7.5 Key Market Developments
14.7.6 Key Strategies
14.8 Macronix International Co., Ltd
14.8.1 Overview 14.8.2 Offerings 14.8.3 Key Financials 14.8.4 Business Segment & Geographic Overview
14.8.5 Key Market Developments
14.8.6 Key Strategies
14.9 Cypress Semiconductor Corporation
14.9.1 Overview 14.9.2 Offerings 14.9.3 Key Financials 14.9.4 Business Segment & Geographic Overview
14.9.5 Key Market Developments
14.9.6 Key Strategies
14.10 Tektronix, Inc
14.10.1 Overview 14.10.2 Offerings 14.10.3 Key Financials 14.10.4 Business Segment & Geographic Overview
14.10.5 Key Market Developments
14.10.6 Key Strategie
