Global Memory Packaging Market Size, Trends, and Growth Opportunity, By Platform (Flip-chip, Lead Frame, Wafer Level Chip Scale Packaging, Through-silicon Via (TSV), Wire-bond), Application (NAND Flash Packaging, NOR Flash Packaging, DRAM Packaging), End User (IT and Telecommunication, Consumer Electronics, Embedded Systems, Automotive, Other) By Region and forecast till 2030.
Global Memory Packaging Market
Global Memory Packaging Market was valued at USD 24.56 Billion in 2022 and is slated to reach USD 42.10 Billion by 2030 at a CAGR of 6.96% from 2023-2030.
Little semiconductor chips are used to create memory, which is subsequently packaged in a less fragile manner to enable integration into the computer system. The majority of the time, chip packages are integrated into larger packaging. Circuits with memory integration are added where the components must work effectively. Then, there are many different physical packing options for computer memory.
Market Drivers
Throughout the forecast period, market growth is anticipated to be driven by the rising demand for memory packing in the automotive industry. Due to the widespread usage of low-density (low-MB) memory in the automotive industry and the rising popularity of autonomous driving and in-car entertainment, DRAM memory may soon become more widely accepted. All of these factors together increase demand for memory packaging in the automobile industry and accelerate market growth. During the anticipated period, the consumer electronics industry's rapid expansion is anticipated to drive the market for memory packing. They are found in many different electronic gadgets, including tablets, cellphones, Desktops, music players, and netbooks. The consumer electronics sector has grown as a result of the popularity of mobile-connected gadgets like tablets and smartphones. Hence, rising consumer electronics demand eventually drives up memory demand and accelerates the development of memory packaging.
Market Restraints
New difficulties for market expansion are brought on by the rising need for larger memory densities and bandwidth, varied functionality, and lower power usage. To meet the demand for high reliability while retaining low prices, manufacturability, and yield requirements, packaging solutions must overcome these difficulties. This inhibits market expansion. Throughout the forecast period, semiconductor-based memory devices will become quite common. Unfortunately, it is exceedingly expensive to build a factory from scratch that produces memory devices. The cost of these devices, which includes wafers, transistors, MOSFETs, and cooling systems, adds to the entire price of memory devices. This eventually hinders market expansion.
Impact of COVID-19
Although Asia-Pacific, particularly China, is one of the key influences on the market analyzed, it is anticipated that the COVID-19 epidemic will cause severe imbalances in the supply chain. Also, several local governments in the Asia-Pacific region have made long-term investments in the semiconductor industry and are therefore anticipated to restore market growth. For instance, to fund the second phase of the National IC Investment Fund 2030, the Chinese government raised between US$23 and US$30 billion. Economic effects on various regions of the world are also anticipated to pose significant challenges to the growth of the semiconductor market, directly affecting the availability of crucial raw materials required for the advanced memory packaging market globally. This is due to uncertainty in the market's recovery time from the pandemic.
Recent Developments
Sony Semiconductors and Silicon Catalyst, a global provider of semiconductors, have joined as of November 2021. Through this relationship, the two businesses have been able to develop cutting-edge memory chips and provide consumers with superior options.
Market Segmentation
Global Memory Packaging Market is segmented By Platform, Application, and End User. By Platforms such as Flip-chip, Lead Frame, Wafer Level Chip Scale Packaging, Through-silicon Via (TSV), and Wire-bond. By Applications such as NAND Flash Packaging, NOR Flash Packaging, and DRAM Packaging. By End Users such as IT and Telecommunication, Consumer Electronics, Embedded Systems, Automotive, Other.
Regional Analysis
Global Memory Packaging Market is segmented into five regions Americas, Europe, Asia-Pacific, and the Middle East & Africa. Due to the increasing demand for memory packaging from consumer electronics, automotive, and other end-user industries in this area, Asia-Pacific now has a dominant position in the market. A sizable consumer base in the low- and middle-income population will also contribute to the market expansion in this area.
Key Players
This report includes a list of numerous Key Players, namely HANA Micron Inc. (South Korea), Formosa Advanced Technologies Co., Ltd. (Taiwan), ASE (Taiwan), Amkor Technology (U.S.), Powertech Technology Inc. (U.S.), ChipMOS TECHNOLOGIES INC. (Taiwan), SCHOTT (Germany), KYOCERA Corporation (Japan), Materion Corporation (U.S.), Egide (France), SGA Technologies (U.K.).
Market Taxonomy
By Platform
• Flip-chip
• Lead Frame
• Wafer Level Chip Scale Packaging
• Through-silicon Via (TSV)
• Wire-bond
By Application
• NAND Flash Packaging
• NOR Flash Packaging
• DRAM Packaging
By End User
• IT and Telecommunication
• Consumer Electronics
• Embedded Systems
• Automotive
• Other
By Region
• North America Latin America
• Europe
• Asia Pacific
• Middle East & Africa.
Global Memory Packaging Market
1 Introduction
1.1 Objective of the Study
1.2 Market Definition
1.3 Market Scope
2 Research Methodology
2.1 Data Mining
2.2 Validation
2.3 Primary Interviews
2.4 List of Data Sources
3 Executive Summary
4 Global Memory Packaging Market Outlook
4.1 Overview
4.2 Market Dynamics
4.2.1 Drivers
4.2.2 Restraints
4.2.3 Opportunities
4.2.4 Cumulative Impact due to recent Energy Crisis
4.2.5 Cumulative Impact due to nearing Economic Downturn
4.2.6 Post Covid-19 World Supply and Demand Conditions
4.2.7 Cumulative Impact of Russia-Ukraine Conflict
4.3 Porters Five Force Model
4.4 Value Chain Analysis
5 Global Memory Packaging Market, By Platform
5.1 Y-o-Y Growth Comparison, By Platform
5.2 Global Memory Packaging Market Share Analysis, By Platform
5.3 Global Memory Packaging Market Size and Forecast, By Platform
5.3.1 Flip-chip
5.3.2 Lead Frame
5.3.3 Wafer Level Chip Scale Packaging
5.3.4 Through-silicon Via (TSV)
5.3.5 Wire-bond
6 Global Memory Packaging Market, By Application
6.1 Y-o-Y Growth Comparison, By Application
6.2 Global Memory Packaging Market Share Analysis, By Application
6.3 Global Memory Packaging Market Size and Forecast, By Application
6.3.1 NAND Flash Packaging
6.3.2 NOR Flash Packaging
6.3.3 DRAM Packaging
7 Global Memory Packaging Market, By End User
7.1 Y-o-Y Growth Comparison, By End User
7.2 Global Memory Packaging Market Share Analysis, By End User
7.3 Global Memory Packaging Market Size and Forecast, By End User
7.3.1 IT and Telecommunication
7.3.2 Consumer Electronics
7.3.3 Embedded Systems
7.3.4 Automotive
7.3.5 Other
8 Global Memory Packaging Market, By Region
8.1 Global Memory Packaging Market Share Analysis, By Region
8.2 Global Memory Packaging Market Share Analysis, By Region
8.3 Global Memory Packaging Market Size and Forecast, By Region
9 North America Memory Packaging Market Analysis and Forecast (2023-2030)
9.1 Introduction
9.2 North America Memory Packaging Market Share Analysis, By Platform
9.3 North America Memory Packaging Market Size and Forecast, By End User
9.4 North America Memory Packaging Market Size and Forecast, By Application
9.5 North America Memory Packaging Market Size and Forecast, By Country
9.5.1 U.S.
9.5.2 Canada
9.5.3 Mexico
10EuropeMemory Packaging Market Analysis and Forecast (2023-2030)
10.1 Introduction
10.2 Europe Memory Packaging Market Share Analysis, By Platform
10.3 Europe Memory Packaging Market Size and Forecast, By End User
10.4 Europe Memory Packaging Market Size and Forecast, By Application
10.5 Europe Memory Packaging Market Size and Forecast, By Country
10.5.1 Germany
10.5.2 France
10.5.3 UK
10.5.4. Rest of Europe
11Asia Pacific Memory Packaging Market Analysis and Forecast (2023-2030)
11.1 Introduction
11.2 Asia Pacific Memory Packaging Market Share Analysis, By Platform
11.3 Asia Pacific Memory Packaging Market Size and Forecast, By End User
11.4 Asia Pacific Memory Packaging Market Size and Forecast, By Application
11.5 Asia Pacific Memory Packaging Market Size and Forecast, By Country
11.5.1 China
11.5.2 Japan
11.5.3 India
11.5.4. Rest of Asia Pacific
12Latin America Memory Packaging Market Analysis and Forecast (2023-2030)
12.1 Introduction
12.2 Latin America Memory Packaging Market Share Analysis, By Platform
12.3 Latin America Memory Packaging Market Size and Forecast, By End User
12.4 Latin America Memory Packaging Market Size and Forecast, By Application
12.5 Latin America Memory Packaging Market Size and Forecast, Country
12.5.1. Brazil
12.5.2.Rest of Latin America
13Middle East Memory Packaging Market Analysis and Forecast (2023-2030)
13.1 Introduction
13.2 Middle East Memory Packaging Market Share Analysis, By Platform
13.3 Middle East Memory Packaging Market Size and Forecast, By End User
13.4 Middle East Memory Packaging Market Size and Forecast, By Application
13.5 Middle East Memory Packaging Market Size and Forecast, By Country
13.5.1. Saudi Arabia
13.5.2. UAE
13.5.3. Egypt
13.5.4. Kuwait
13.5.5. South Africa
14Competitive Analysis
14.1 Competition Dashboard
14.2 Market share Analysis of Top Vendors
14.3 Key Development Strategies
15Company Profiles
15.1 HANA Micron Inc. (South Korea)
15.1.1 Overview
15.1.2 Products
15.1.3 Key Financials
15.1.4 Business Segment & Geographic Overview
15.1.5 Key Market Developments
15.1.6 Key Strategies
15.2. Formosa Advanced Technologies Co., Ltd. (Taiwan)
15.2.1 Overview
15.2.2 Products
15.2.3 Key Financials
15.2.4 Business Segment & Geographic Overview
15.2.5 Key Market Developments
12.2.6 Key Strategies
15.3. Amkor Technology (U.S.)
15.3.1 Overview
15.3.2 Products
15.3.3 Key Financials
15.3.4 Business Segment & Geographic Overview
15.3.5 Key Market Developments
15.3.6 Key Strategies
15.4 Powertech Technology Inc. (U.S.)
15.4.1 Overview
15.4.2 Products
15.4.3 Key Financials
15.4.4 Business Segment & Geographic Overview
15.4.5 Key Market Developments
15.4.6 Key Strategies
15.5 ChipMOS TECHNOLOGIES INC. (Taiwan)
15.5.1 Overview
15.5.2 Products
15.5.3 Key Financials
15.5.4 Business Segment & Geographic Overview
15.5.5 Key Market Developments
15.5.6 Key Strategies
15.6 SCHOTT (Germany)
15.6.1 Overview
15.6.2 Products
15.6.3 Key Financials
15.6.4 Business Segment & Geographic Overview
15.6.5 Key Market Developments
15.6.6 Key Strategies
15.7 KYOCERA Corporation (Japan)
15.7.1 Overview
15.7.2 Products
15.7.3 Key Financials
15.7.4 Business Segment & Geographic Overview
15.7.5 Key Market Developments
15.7.6 Key Strategies
15.8 Materion Corporation (U.S.)
15.8.1 Overview
15.8.2 Products
15.8.3 Key Financials
15.8.4 Business Segment & Geographic Overview
15.8.5 Key Market Developments
15.8.6 Key Strategies
15.9 Egide (France)
15.9.1 Overview
15.9.2 Products
15.9.3 Key Financials
15.9.4 Business Segment & Geographic Overview
15.9.5 Key Market Developments
15.9.6 Key Strategies
15.10 SGA Technologies (U.K.)
15.10.1 Overview
15.10.2 Products
15.10.3 Key Financials
15.10.4 Business Segment & Geographic Overview
15.10.5 Key Market Developments
15.10.6 Key Strategies
