Global Die Attach Machine Market Size, Trends & Growth Opportunity, By Type (Flip Chip Bonder and Die Bonder), By Technique (Epoxy, Soft Solder, Sintering, Eutectic, and Others), By Application (RF & MEMS, Optoelectronics, Logic, Memory, CMOS Image Sensors, LED, and Others), and Forecast till 2027
Report ID : QR1001482 | Industries : Semiconductors and Electronics | Published On :April 2022 | Page Count : 253Global Die Attach Machine Market
The global die attach machine market size was valued at $1,129.0 million in 2020, and is projected to reach $1,813.1 million by 2028, registering a CAGR of 6.1% from 2021 to 2028.
Die attach machines, also known as die mount or die bond machines, are used to attach silicon chips to the die cavity or die pad of a semiconductor package's support structure. There are two methods for doing this: eutectic die attach and sticky die attach. In both methods, die attach equipment is used to mount the die in the semiconductor package. The adhesive die attach process uses die attach materials such as epoxy, polyimide, and silver-filled glass to mount the die on the die cavity or die pad, whereas the eutectic die attach process uses eutectic alloy to attach the die to the cavity.
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Drivers: The die attach machine market for electric circuit boards is expected to grow in response to consumer electronics demand, which will fuel die-attach machine demand. A rise in demand for hybrid circuits in medical equipment, owing to an increase in the number of patients, is fueling the demand for semiconductor chips. Similarly, the rise can be ascribed to the growing need for user-friendly electronic products as well as the growing residential sector, which drives consumer electronics demand globally. Several devices, such as optoelectronics, MEMS, and MOEMS, are used in the mass production of electronic products in China and Taiwan, including smartphones, wearables, and white goods.
Restraints: The market's growth is hampered by fluctuating raw material prices.
Impact of Covid-19
COVID-19 cases are on the rise around the world, causing a global economic slump. COVID-19 has an impact on every area of the economy, including the semiconductor industry worldwide. COVID-19, on the other hand, has little effect on equipment demand. Palomar Technologies, for example, announced in April 2020 that crucial semiconductor components are in high demand. Orders for its 3880 die attach machines for remote machine equipment, medical devices, and robots have increased, according to the business. As a result, demand for equipment has not decreased as a result of COVID-19. As a result, the worldwide die attach machine market is expected to grow in the future years.
Segmentation By Type: Global Die Attach Machine Market is classified on the basis of Type into Flip Chip Bonder and Die Bonder.
Segmentation By Technique: Global Die Attach Machine Market is classified on the basis of Technique into Epoxy, Soft Solder, Sintering, Eutectic, and Others.
Segmentation By Application: Global Die Attach Machine Market is classified on the basis Application into RF & MEMS, Optoelectronics, Logic, Memory, CMOS Image Sensors, LED, and Others.
Segmentation By Region: Global Die Attach Machine Market is classified on the basis Region into North America, Europe, Asia Pacific, Latin America, and Middle East & Africa.
Competitive Landscape: Anza Technology, Inc, ASM Pacific Technology Limited, BE Semiconductor Industries N.V, Dr. Tresky AG, Fasford Technology Co. Limited, Inseto UK Limited, Kulicke and Soffa Industries, Inc., MicroAssembly Technologies Limited, Palomar Technologies, and Shinkawa Limited.
Market Taxonomy
By Type
- Flip Chip Bonder
- Die Bonder
By Technique
- Epoxy
- Soft Solder
- Sintering
- Eutectic
- Others
By Application
- RF & MEMS
- Optoelectronics
- Logic
- Memory
- CMOS Image Sensors
- LED
- Others
By Region
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East & Africa
Key Questions Addressed by the Report
- What are the Key Opportunities in Global Die Attach Machine Market?
- What will be the growth rate from 2020 to 2027?
- Which segment/region will have highest growth?
- What are the factors that will impact/drive the Market?
- What is the competitive Landscape in the Industry?
- What is the role of key players in the value chain?
Global Die Attach Machine Market TOC
1. Introduction
1.1 Objective of the Study
1.2 Market definition
1.3 Market Scope
2. Research Methodology
2.1 Data Mining
2.2 Validation
2.3 Primary Interviews
2.4 List of Data Sources
3. Executive Summary
4. Global Die Attach Machine Market Outlook
4.1 Overview
4.2 Market Dynamics
4.2.1 Drivers
4.2.2 Restraints
4.2.3 Opportunities
4.2.4 Challenges
4.3 Porters Five Force Model
4.4 Value Chain Analysis
5. Global Die Attach Machine Market, By Type
5.1 Y-o-Y Growth Comparison, By Type
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- Global Die Attach Machine Market Share Analysis, By Type
5.3 Global Die Attach Machine Market Size and Forecast, By Type
5.3.1 Flip Chip Bonder
5.3.2 Die Bonder
6. Global Die Attach Machine Market, By Technique
6.1 Y-o-Y Growth Comparison, By Technique
6.2 Global Die Attach Machine Market Share Analysis, By Technique
6.3 Global Die Attach Machine Market Size and Forecast, By Technique
6.3.1 Epoxy
6.3.2 Soft Solder
6.3.3 Sintering
6.3.4 Eutectic
6.3.5 Others
7. Global Die Attach Machine Market, By Application
7.1 Y-o-Y Growth Comparison, By Application
7.2 Global Die Attach Machine Market Share Analysis, By Application
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- Global Die Attach Machine Market Size and Forecast, By Application
7.3.1 RF & MEMS
7.3.2 Optoelectronics
7.3.3 Logic
7.3.4 Memory
7.3.5 CMOS Image Sensors
7.3.6 LED
7.3.7 Others
8. Global Die Attach Machine Market, By Region
8.1 Global Die Attach Machine Market Share Analysis, By Region
8.2 Global Die Attach Machine Market Size and Forecast, By Region
8.2 Global Die Attach Machine Market Size and Forecast, By Region
9. North America Die Attach Machine Market Analysis and Forecast (2021-2027)
9.1 Introduction
9.2 North America Die Attach Machine Market Share Analysis, By Type
9.3 North America Die Attach Machine Market Size and Forecast, By Technique
9.4 North America Die Attach Machine Market Size and Forecast, By Application
9.5 North America Die Attach Machine Market Size and Forecast, By Country
9.5.1 US
9.5.2 Canada
9.5.3 Mexico
10. Europe Die Attach Machine Market Analysis and Forecast (2021-2027)
10.1 Introduction
10.2 Europe Die Attach Machine Market Share Analysis, By Type
10.3 Europe Die Attach Machine Market Size and Forecast, By Technique
10.4 Europe Die Attach Machine Market Size and Forecast, By Application
10.5 Europe Die Attach Machine Market Size and Forecast, By Country
10.5.1 UK
10.5.2 Germany
10.5.3 France
10.5.4 Rest of Europe (Russia, Spain, Finland, Denmark, Italy, Greece, and Sweden)
11. Asia Pacific Die Attach Machine Market Analysis and Forecast (2021-2027)
11.1 Introduction
11.2 Asia Pacific Die Attach Machine Market Share Analysis, By Type
11.3 Asia Pacific Die Attach Machine Market Size and Forecast, By Technique
11.4 Asia Pacific Die Attach Machine Market Size and Forecast, By Application
11.5 Asia Pacific Die Attach Machine Market Size and Forecast, By Country
11.5.1 China
11.5.2 India
11.5.3 Japan
11.5.4 South Korea
11.2.5 Rest of Asia Pacific (Hong Kong, Australia, Singapore, New Zealand, Indonesia, Malaysia, and Taiwan)
12 Latin America Die Attach Machine Market Analysis and Forecast (2021-2027)
12.1 Introduction
12.2 Latin America Die Attach Machine Market Share Analysis, By Type
12.3 Latin America Die Attach Machine Market Size and Forecast, By Technique
12.4 Latin America Die Attach Machine Market Size and Forecast, By Application
12.5 Latin America Die Attach Machine Market Size and Forecast, Country
12.5.1. Brazil
12.5.2. Rest of Latin America
13 Middle East Die Attach Machine Market Analysis and Forecast (2021-2027)
13.1 Introduction
13.2 Middle East Die Attach Machine Market Share Analysis, By Type
12.3 Middle East Die Attach Machine Market Size and Forecast, By Technique
13.4 Middle East Die Attach Machine Market Size and Forecast, By Application
13.5 Middle East Die Attach Machine Market Size and Forecast, By Country
13.5.1. Saudi Arabia
13.5.2. UAE
13.5.3. Egypt
13.5.4. Kuwait
13.5.5. South Africa
14. Competitive Analysis
14.1 Competition Dashboard
14.2 Market share Analysis of Top Vendors
14.3 Key Development Strategies
15. Company Profiles
15.1 Anza Technology, Inc
15.1. Overview
15.1.2 Offerings
15.1.3 Key Financials
15.1.4 Business Segment & Geographic Overview
15.1.5 Key Market Developments
15.1.6 Key Strategies
15.2 ASM Pacific Technology Limited
15.2.1. Overview
15.2.2 Offerings
15.2.3 Key Financials
15.2.4 Business Segment & Geographic Overview
15.2.5 Key Market Developments
15.2.6 Key Strategies
15.3. BE Semiconductor Industries N.V
15.3.1 Overview
15.3.2 Offerings
15.3.3 Key Financials
15.3.4 Business Segment & Geographic Overview
15.3.5 Key Market Developments
15.3.6 Key Strategies
15.4. Dr. Tresky AG
15.4.1 Overview
15.4.2 Offerings
15.4.3 Key Financials
15.4.4 Business Segment & Geographic Overview
15.4.5 Key Market Developments
15.4.6 Key Strategies
15.5. Fasford Technology Co. Limited
15.5.1 Overview
15.5.2 Offerings
15.5.3 Key Financials
15.5.4 Business Segment & Geographic Overview
15.5.5 Key Market Developments
15.5.6 Key Strategies